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Global Mixed-mode Technology Inc.
G1431
2W Stereo Audio Amplifier
Features
Internal Gain Control, Which Eliminates External Gain-Setting Resistors Depop Circuitry Integrated Output Power at 1% THD+N, VDD=5V --2.0W/CH (typical) into a 4 Load --1.2W/CH (typical) into a 8 Load Bridge-Tied Load (BTL) Supported Fully differential Input Shutdown Control Available Surface-Mount Power Package 20-Pin TSSOP-P & 20-Pin TQFN 4X4
General Description
G1431 is a stereo audio power amplifier in 20pin TSSOP thermal pad package or 20-pin TQFN 4X4. It can drive 2W continuous RMS power into 4 load per channel in Bridge-Tied Load (BTL) mode at 5V supply voltage. Its THD is smaller than 1% under the above operation condition. To simplify the audio system design in the notebook application and to enlarge the driving power, G1431 supports the Bridge-Tied Load (BTL) mode for driving the speakers. For the low current consumption applications, the SHDN mode is supported to disable G1431 when it is idle. The current consumption can be reduced to 150A (typically). Amplifier gain is internally configured and controlled by two terminals (GAIN0, GAIN1). BTL gain settings of 6dB, 10dB, 15.6dB, 21.6dB are provided.
Applications
Stereo Power Amplifiers for Notebooks or Desktop Computers Multimedia Monitors Stereo Power Amplifiers for Portable Audio Systems
Ordering Information
ORDER MARKING NUMBER
G1431F2U G1431R9U G1431 1431
TEMP. RANGE
PACKAGE (Pb free)
-40C to +85C TSSOP-20 (FD) -40C to +85C TQFN4X4-20 R9:TQFN4X4-20
Note: F2: TSSOP-20 (FD) U: Tape & Reel
Pin Configuration
ROUT+
ROUT-
PVDD
RIN-
VDD
G1431
GND GAIN0 GAIN1 10 9 NC GND GND BYPASS LIN+ LOUT+ LINPVDD RIN+ LOUTLIN+ 1 2 3 4 5 6 7 8 9 20 19 18 17 GND SHUTDOWN ROUT+ RINVDD PVDD ROUTGND NC GND
13
14
12
SHUTDOWN GND GND GAIN0 GAIN1
16 17 18 19 20 1 2 3 4 5 Thermal Pad
15
11
8 7 6
Thermal Pad
16 15 14 13 12 11
BYPASS 10
LOUT+
LOUT-
RIN+
LIN-
Top View TSSOP-20 (FD)
G1431 TQFN4X4-20
PVDD
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Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . .6V Operating Ambient Temperature Range TA . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . -40C to +85C Maximum Junction Temperature, TJ . . . . . . . . . . 150C Storage Temperature Range, TSTG . . . .-65C to+150C Reflow Temperature (soldering, 10sec) . . . . . . . .260C
G1431
Power Dissipation (1) TA 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7W TA 70C . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7W Electrostatic Discharge, VESD Human body mode . . . . . . . . . . . . . . . . . . . . . 3000V(2)
Note:
(1) (2)
: Recommended PCB Layout : Human body model : C = 100pF, R = 1500, 3 positive pulses plus 3 negative pulses
Electrical Characteristics
DC Electrical Characteristics, TA=+25C PARAMETER
Supply voltage VDD High-Level Input voltage, VIH Low-Level Input voltage, VIL DC Differential Output Voltage Supply Current in Mute Mode IDD in Shutdown
SYMBOL
VDD VIH VIL VO(DIFF) IDD ISD
CONDITIONS
SHUTDOWN , GAIN0, GAIN1
SHUTDOWN , GAIN0, GAIN1
MIN
4.5 2 ---------
TYP
5 ----5 7.5 160
MAX
5.5 --0.8 50 11 300
UNIT
V V V mV mA A
VDD = 5V,Gain = 2 VDD = 5V Stereo BTL VDD = 5V
(AC Operation Characteristics, VDD = 5.0V, TA=+25C, RL = 4, unless otherwise noted) PARAMETER
Output power (each channel) see Note
SYMBOL
P(OUT)
CONDITIONS
THD = 1%, BTL, RL = 4 G=-2V/V THD = 1%, BTL, RL = 8 G=-2V/V THD = 10%, BTL, RL = 4 G=-2V/V THD = 10%, BTL, RL = 8 G=-2V/V PO = 1.6W, BTL, RL = 4 G=-2V/V PO = 1W, BTL, RL = 8 G=-2V/V THD = 5% F=1kHz, BTL mode G=-2V/V CBYP=1F f = 1kHz PO = 500mW, BTL, G=-2V/V BTL,G=-2V/V, A Weighted filter
MIN
-------------------
TYP
2 1.2 2.5 1.6 100 60 15 68
MAX
-----------------
UNIT
W
Total harmonic distortion plus noise Maximum output power bandwidth Power supply ripple rejection Channel-to-channel output separation Input impedance Signal-to-noise ratio Output noise voltage
THD+N BOM PSRR
m% kHz dB dB M dB V (rms)
ZI Vn
80 --See Table 2 --90 ----45 ---
Note :Output power is measured at the output terminals of the IC at 1kHz.
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Typical Characteristics
Table of Graphs FIGURE
THD +N Total harmonic distortion plus noise Vn Output noise voltage Supply ripple rejection ratio Crosstalk PO Output power PD Power dissipation vs Frequency vs Output Power vs Frequency vs Frequency vs Frequency vs Load Resistance vs Output Power 1,2,7,8,13,14 3,4,5,6,9,10,11,12,15,16,17,18 21 19 20 22 23
G1431
Total Harmonic Distortion Plus Noise vs Frequency
10 5
Total Harmonic Distortion Plus Noise vs Frequency
10 5
2 1 0.5 % 0.2 0.1 0.05
VDD=5V RL=3 Po=1.75W
Av=21.6dB
2 1
VDD=5V RL=3 Av=6dB Po=0.5W
Av=15.6dB
%
0.5
0.2
Po=1W
0.1
Av=10dB Av=6dB
0.05
0.02
0.02 0.01 20
Po=1.5W
50 100 200 500 Hz 1k 2k 5k 10k 20k
0.01 20
50
100
200
500 Hz
1k
2k
5k
10k
20k
Figure 1
Figure 2
Total Harmonic Distortion Plus Noise vs Output Power
10 5 10
Total Harmonic Distortion Plus Noise vs Output Power
5
VDD=5V RL=3, Av=6dB 15kHz 1kHz
%
15kHz
VDD=5V RL=3, Av=10dB
2 1 0.5 % 0.2 0.1 0.05
2 1 0.5
1kHz
0.2 0.1 0.05
20Hz
20Hz
0.02 0.02 0.01 3m 0.01 3m
5m
10m
20m
50m
100m W
200m
500m
1
2
3
5m
10m
20m
50m
100m W
200m
500m
1
2
3
Figure 3
Figure 4
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Typical Characteristics (continued)
Total Harmonic Distortion Plus Noise vs Output Power
10 5 10 5
G1431
Total Harmonic Distortion Plus Noise vs Output Power
15kHz
15kHz
2 1 0.5 % 0.2 0.1 0.05
2 1
1kHz
1kHz
%
0.5
0.2 0.1
0.02 0.01 3m
VDD=5V RL=3 Av=15.6dB
5m 10m 20m 50m
20Hz
0.05
0.02 0.01 3m
VDD=5V RL=3 Av=21.6dB
5m 10m 20m 50m
20Hz
100m W
200m
500m
1
2
3
100m W
200m
500m
1
2
3
Figure 5
Figure 6
Total Harmonic Distortion Plus Noise vs Frequency
10 5
Total Harmonic Distortion Plus Noise vs Frequency
10 5
2 1 0.5 % 0.2 0.1 0.05
VDD=5V RL=4 Po=1.75W
Av=21.6dB
2 1 0.5
VDD=5V RL=4 Av=6dB Po=0.25W
Av=15.6dB Av=6dB
% 0.2 0.1 0.05
Po=1.5W
0.02
Av=10dB
50 100 200 500 Hz 1k 2k 5k 10k 20k
0.02 0.01 20
Po=1W
50 100 200 500 Hz 1k 2k 5k 10k 20k
0.01 20
Figure 7
Figure 8
Total Harmonic Distortion Plus Noise vs Output Power
10 5 10 5
Total Harmonic Distortion Plus Noise vs Output Power
15kHz VDD=5V RL=4, Av=10dB
15kHz
2 1 0.5 % 0.2 0.1 0.05
VDD=5V RL=4, Av=6dB
2 1 0.5
1kHz
1kHz
% 0.2 0.1 0.05
20Hz
0.02 0.02 0.01 3m 5m 10m 20m 50m 100m W 200m 500m 1 2 3 0.01 3m 5m
20Hz
10m
20m
50m
100m W
200m
500m
1
2
3
Figure 9
Figure 10
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Typical Characteristics (continued)
G1431
Total Harmonic Distortion Plus Noise vs Output Power
10 5
Total Harmonic Distortion Plus Noise vs Output Power
10 5
15kHz
15kHz
2 1 0.5 % 0.2 0.1 0.05
2 1 0.5
1kHz
1kHz
% 0.2 0.1
0.02 0.01 3m
VDD=5V RL=4 Av=15.6dB
5m 10m 20m 50m 100m W
20Hz
0.05
VDD=5V RL=4 Av=21.6dB
5m 10m 20m 50m 100m W
20Hz
0.02
200m
500m
1
2
3
0.01 3m
200m
500m
1
2
3
Figure 11
Figure 12
Total Harmonic Distortion Plus Noise vs Frequency
10 5
10
Total Harmonic Distortion Plus Noise vs Frequency
5
2 1 0.5 % 0.2 0.1 0.05
VDD=5V RL=8 Av=6dB
2 1 0.5 %
VDD=5V RL=8 Po=1W
Av=15.6dB
Po=0.25W Po=1W Po=0.5W
50 100 200 500 Hz 1k 2k 5k 10k 20k
0.2 0.1 0.05
Av=21.6dB Av=6dB
0.02 0.01 20
0.02
Av=10dB
50 100 200 500 Hz 1k 2k 5k 10k 20k
0.01 20
Figure 13
Figure 14
Total Harmonic Distortion Plus Noise vs Output Power
10 5
10 5
Total Harmonic Distortion Plus Noise vs Output Power
VDD=5V RL=8 Av=10dB
2 1 0.5 % 0.2 0.1 0.05
15kHz
VDD=5V RL=8 Av=6dB
2 1 0.5 %
15kHz
1kHz
0.2 0.1 0.05
1kHz
20Hz
0.02 0.01 3m
0.02
20Hz
5m 10m 20m 50m 100m W 200m 500m 1 2 3
5m
10m
20m
50m
100m W
200m
500m
1
2
3
0.01 3m
Figure 15
Figure 16
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Typical Characteristics (continued)
Total Harmonic Distortion Plus Noise vs Output Power
10 5 10
G1431
Total Harmonic Distortion Plus Noise vs Output Power
5
15kHz
2 1 0.5 % 0.2 0.1 0.05
VDD=5V RL=8 Av=15.6dB
15kHz
2 1
1kHz
%
0.5
1kHz
0.2 0.1 0.05
20Hz
0.02 0.01 3m
0.02 0.01 3m
VDD=5V RL=8 Av=21.6dB
5m 10m 20m 50m 100m W
20Hz
5m
10m
20m
50m
100m W
200m
500m
1
2
3
200m
500m
1
2
3
Figure 17
Figure 18
Supply Ripple Rejection Ratio vs Frequency
+0 -10 -20 -30 -40 d B -50 -60 -70 -80 -90 -100 20
Channel Separation
-20 -25 -30
TT
T
T
T
TT
T
VDD=5V RL=8 Cb=1F Av=21.6dB
d B
-35 -40 -45 -50 -55 -60 -65 -70 -75
VDD=5V Po=1W RL=8 Av=6dB L TO R
Av=6dB
-80 -85 -90 -95
R TO L
50 100 200 500 Hz 1k 2k 5k 10k 20k
50
100
200
500 Hz
1k
2k
5k
10k
20k
-100 20
Figure 19
Figure 20
Output Noise vs Frequency
500u 400u 300u 200u
Output Power vs Load Resistance
2.5
Output Power(W)
VDD=5V RL=4 Av=6dB A-Weighted filter
2
100u V 70u 60u 50u 40u 30u 20u
1.5 1 VDD=5V THD+N=1% Each Channel
0.5
10u 20
50
100
200
500 Hz
1k
2k
5k
10k
20k
0 0 10 20 30 Load Resistance() 40
Figure 21
Figure 22
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Typical Characteristics (continued)
G1431
Power Dissipation vs Output Power
1.8 1.6 1.4 Power Dissipation 1.2 1 0.8 0.6 0.4 0.2 0 0 0.5 1 1.5 Po-Output Pow er(W) 2 2.5 RL=8 RL=4 VDD=5V Each Channel RL=3
Figure 23
Recommended Minimum Footprint
TSSOP-20 (FD)
TQFN4X4-20
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Pin Description
PIN TSSOP-20(FD) TQFN4X4-20
1,11,13,20 2 3 4 5 6,15 7 8 9 10 12 14 16 17 18 19 8,9,17,18 19 20 1 2 3,12 4 5 6 7 10 11 13 14 15 16
G1431
FUNCTION
NAME
GND/HS GAIN0 GAIN1 LOUT+ LINPVDD RIN+ LOUTLIN+ BYPASS NC ROUTVDD RINROUT+
SHUTDOWN
I/O
I I O I I O I Bit 0 of gain control Bit 1 of gain control
Ground connection for circuitry, directly connected to thermal pad.
Left channel + output in BTL mode Negative left input for fully differential inputs. Power supply for output stages. Positive right input for fully differential inputs. AC ground for singleended inputs. Left channel - output in BTL mode Positive left input for fully differential inputs. AC ground for single-ended inputs. Tap to voltage divider for internal mid-supply bias generator. NC Right channel - output in BTL mode Analog VDD input supply. This terminal needs to be isolated from PVDD to achieve highest performance. Negative right input for fully differential inputs. Right channel + output in BTL mode Places entire IC in shutdown mode when held low
O
I O I
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Application Circuit
G1431
1
GND
GND
20
2
GAIN0
SHUTDOWN
19
TO SYSTEM CONTROL
3
GAIN1
ROUT+
18 CRINC3 VDD 1F CS1
4 CLINC1 1F CRIN+ C4 1F VDD
LOUT+
RIN-
17
RIGHT LINE INPUT SIGNAL R CS2 10F SPEAKER
L
LEFT LINE INPUT SIGNAL
5
LIN-
VDD
16
6
PVDD
PVDD
15
1F
SPEAKER
7
RIN+
ROUT-
14
8
LOUT-
GND
13
CLIN+ C2 1F
9 Cb C5 1F
LIN+
NC
12
10
BYPASS
GND
11
Typical G1431 Application Circuit Using Single-Ended Inputs
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Application Circuit (continued)
G1431
1
GND
GND
20
2
GAIN0
SHUTDOWN
19
TO SYSTEM CONTROL
3
GAIN1
ROUT+
18 CRINC3 VDD 1F CS1 RIGHT NEGATIVE DIFFERENTIAL INPUT SIGNAL
4 LEFT NEGATIVE DIFFERENTIAL INPUT SIGNAL CLINC1 1F CRIN+ C4 1F VDD
LOUT+
RIN-
17
5
LIN-
VDD
16
R
L
CS2 SPEAKER 10F
6
PVDD
PVDD
15
1F
SPEAKER
RIGHT POSITIVE DIFFERENTIAL INPUT SIGNAL
7
RIN+
ROUT-
14
8
LOUT-
GND
13
LEFT POSITIVE DIFFERENTIAL INPUT SIGNAL
CLIN+ C2 1F
9 Cb C5 1F
LIN+
NC
12
10
BYPASS
GND
11
Typical G1431 Application Circuit Using Differential Inputs
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Application Information
Gain setting via GAIN0 and GAIN1 inputs
The internal gain setting is determined by two input terminals, GAIN0 and GAIN1. The gains listed in Table 1 are realized by changing the taps on the input resistors inside the amplifier. This will cause the internal input impedance, ZI, to be dependent on the gain setting. Although the real input impedance will shift by 30% due to process variation from part-to-part, the actual gain settings are controlled by the ratios of the resistors and the actual gain distribution from part-topart is quite good. Table 1 GAIN0
0 0 1 1
G1431
AV (dB)
21.6 15.6 10 6 30 45 70 90
Table 2 Zi (k)
GAIN1
0 1 0 1
AV (dB)
6 10 15.6 21.6
Input Capacitor In the typical application, an input capacitor Ci is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation. In this case, Ci and the input impedance of the amplifier, Zi, form a high-pass filter with the -3dB determined by the equation: f-3dB= 1/ 2RI Ci The value of Ci is important to consider as it directly affects the bass performance of the application circuit. For example, if the input resistor is 15k, the input capacitor is 1F, the flat bass response will be down to 10.6Hz. Because the small leakage current of the input capacitors will cause the dc offset voltage at the input to the amplifier that reduces the operation headroom, especially at the high gain applications. The lowleakage tantalum or ceramic capacitors are suggested to be used as the input coupling capacitors. When using the polarized capacitors, it is important to let the positive side connecting to the higher dc level of the application. Power Supply Decoupling The G1431 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to make sure the output total harmonic distortion (THD) as low as possible. The optimum decoupling is using two capacitors with different types that target different types of noise on the power supply leads. For high frequency transients, spikes, a good low ESR ceramic capacitor works best, typically 0.1F/1F used and placed as close as possible to the G1431 VDD lead. A larger aluminum electrolytic capacitor of 10F or greater placed near the device power is recommended for filtering low-frequency noise. Optimizing DEPOP Operation Circuitry has been implemented in G1431 to minimize the amount of popping heard at power-up and when coming out of shutdown mode. Popping occurs whenever a voltage step is applied to the speaker and making the differential voltage generated at the two ends of the speaker. To avoid the popping heard, the bypass capacitor should be chosen promptly, 1/(CBx170k) 1/(CI*(RI+RF)). Where 170k is the output impedance of the mid-rail generator, CB is the mid-rail bypass capacitor, CI is the input coupling capacitor, RI is the input impedance, RF is the gain setTEL: 886-3-5788833 http://www.gmt.com.tw
Input Resistance
The typical input impedance at each gain setting is given in the Table 2. Each gain setting is achieved by varying the input resistance of the amplifier, which can be over 6 times from its minimum value to the maximum value. As a result, if a single capacitor is used in the input high pass filter, the -3dB or cut-off frequency will be also change over 3.5 times. To reduce the variation of the cut-off frequency, an additional resistor can be connected from the input pin of the amplifier to the ground, as shown in the figure below. With the extra resistor, the cut-off frequency can be re-calculated using equation : f-3dB= 1/ 2C(R||RI). Using small external R can reduce the variation of the cut-off frequency. But the side effect is small external R will also let (R||RI) become small, the cut-off frequency will be larger and degraded the bass-band performance. The other side effect is with extra power dissipation through the external resistor R to the ground. So using the external resistor R to flatting the variation of the cut-off frequency, the user must also consider the bass-band performance and the extra power dissipation to choose the accepted external resistor R value.
C Input Signal IN R
Zi
Zf
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ting impedance which is on the feedback path. CB is the most important capacitor. Besides it is used to reduce the popping, CB can also determine the rate at which the amplifier starts up during startup or recovery from shutdown mode. De-popping circuitry of G1431 is shown as below Figure 1. The PNP transistor limits the voltage drop across the 120k by slewing the internal node slowly when power is applied. At start-up, the voltage at BYPASS capacitor is 0. The PNP is ON to pull the mid-point of the bias circuit down. So the capacitor sees a lower effective voltage, and thus the charging is slower. This appears as a linear ramp (while the PNP transistor is conducting), followed by the expected exponential ramp of an R-C circuit. For better performance, CB is recommended to be at least 1.5 times of input coupling capacitor CI. For example, if using 1F input coupling capacitor, 2.2F ceramic or tantalum low-ESR capacitors are recommended to achieve the better THD performance.
VDD 100 k 120 k Bypass 100 k
G1431
voltage VO(PP) on the load will be two times than a ground reference configuration. The voltage on the load is doubled, this will also yield 4 times output power on the load at the same power supply rail and loading. Another benefit of using differential driving configuration is that BTL operation cancels the dc offsets, which eliminates the dc coupling capacitor that is needed to cancelled dc offsets in the ground reference configuration. Low-frequency performance is then limited only by the input network and speaker responses. Cost and PCB space can be minimized by eliminating the dc coupling capacitors.
VDD
Vo(PP) RL 2xVo(PP) -Vo(PP)
VDD
Figure 2
Figure 1
Bridged-Tied Load Mode Operation G1431 has two linear amplifiers to drive both ends of the speaker load in Bridged-Tied Load (BTL) mode operation. Figure 2 shows the BTL configuration. The differential driving to the speaker load means that when one side is slewing up, the other side is slewing down, and vice versa. This configuration in effect will double the voltage swing on the load as compared to a ground reference load. In BTL mode, the peak-to-peak
Shutdown mode When the normal operation, the SHUTDOWN pin should be held high. Pulling SHUTDOWN low will mute the outputs and deactivate the most of the circuits. At this moment, the current of this device will be reduced to about 160A to save the battery energy. The SHUTDOWN pin should never be left unconnected during the normal applications. INPUT *
SHUTDOWN Low
AMPLIFIER STATE
OUTPUT Mute
High BTL * Inputs should never be left unconnected X= do not care
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Package Information
D C L D1
G1431
E2
E1 E
H
0.127 TYP
A2 A1 e b
A
0.05
TSSOP-20 (FD) Package Note:
1. JEDCE outline: MP-153 AC/MO-153 ACT (thermally enhanced variations only) 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. 3. Dimension "E1" does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25 per side. 4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material conditions. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimensions "D" and "E1" to be determined at datum plane "H".
SYMBOLS
A A1 A2 b C D D1 E E1 E2 e L
MIN
----0.00 0.80 0.19 0.20 6.40 3.90 4.30 2.70 0.45 0
DIMENSION IN MM NOM
--------1.00 --------6.50 ----6.40 BSC 4.40 ----0.65 BSC 0.60 -----
MAX
1.20 0.15 1.05 0.30 ----6.60 4.40 4.50 3.20 0.75 8
MIN
----0.000 0.031 0.007 0.008 0.252 0.154 0.169 0.106 0.018 0
DIMENSION IN INCH NOM
--------0.039 --------0.256 ----0.252 BSC 0.173 ----0.026 BSC 0.024 -----
MAX
0.047 0.006 0.041 0.012 ----0.260 0.173 0.177 0.126 0.030 8
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G1431
D2 b Pin #1 Identification Chamfer 0.45 X 45
Pin 1 Dot By Marking
D L
E e
E2
Top View
A
A1 A2
TQFN4X4-20 Package DIMENSION IN MM MIN.
0.700 0.000 0.195 0.180 3.950 2.400 3.950 2.400 0.350
SYMBOL
A A1 A2 b D D2 E E2 e L
DIMENSION IN INCH MAX.
0.800 0.050 0.211 0.280 4.050 2.600 4.050 2.600 0.450
NOM.
0.750 ----0.203 0.230 4.000 2.500 4.000 2.500 0.500 BSC 0.400
MIN.
0.028 0.000 0.008 0.007 0.156 0.094 0.156 0.094 0.014
NOM.
0.030 ----0.008 0.009 0.157 0.098 0.157 0.098 0.020 BSC 0.016
MAX.
0.031 0.002 0.008 0.011 0.159 0.102 0.159 0.102 0.018
Taping Specification
PACKAGE
TSSOP-20 (FD) TQFN4X4-20
Feed Direction Feed Direction Typical TSSOP Package Orientation Typical TQFN Package Orientation
Q'TY/ REEL
2,500 ea 3,000 ea
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
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